2
MAX19794
10MHz to 500MHz Dual Analog Voltage Variable
Attenuator with On-Chip 10-Bit SPI-Controlled DAC
V
CC
.......................................................................-0.3V to +5.5V
REF_IN ..............................-0.3V to Minimum (V
CC
+ 0.3V, 3.6V)
REF_SEL
,
DAC_LOGIC,MODE, DWN, UP,
DIN, CLK, CS ................-0.3V to Minimum (V
CC
+ 0.3V, 3.6V)
COMP_OUT, DOUT ..............................................-0.3V to +3.6V
IN_A, OUT_A, IN_B, OUT_B .......................-0.3V to V
CC
+ 0.3V
CTRL (except for test mode) .......................-0.3V to V
CC
+ 0.3V
Maximum CTRL Pin Load Current
(CTRL configured as an output) ....................................0.3mA
RF Input Power at IN_A, IN_B, OUT_A, OUT_B ...........+20dBm
Continuous Power Dissipation (Note 1) ..............................2.8W
Operating Case Temperature Range (Note 2) ...-40NC to +100NC
Maximum Junction Temperature .......................................150NC
Storage Temperature .......................................-65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN
Junction-to-Ambient Thermal Resistance (q
JA
)
(Notes 3, 4) .......................................................... +36癈/W
Junction-to-Case Thermal Resistance (q
JC
)
(Notes 1, 4) .......................................................... +10癈/W
ABSOLUTE MAXIMUM RATINGS
Note 3: Junction temperature T
J
= T
A
+ (B
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS
3.3V DC ELECTRICAL CHARACTERISTICS
(V
CC
= 3.15V to 3.45V, V
CTRL
= 1V, V
DAC_LOGIC
= 0V, RDBK_EN (D9, REG3) = Logic 0, no RF signals applied, all input and output
ports terminated with 50I through DC blocks, T
C
= -40NC to +100NC, unless otherwise noted. Typical values are at V
CC
= 3.3V, V
CTRL
= 1.0V, V
DAC_LOGIC
= 0V, RDBK_EN (D9, REG3) = Logic 0, T
C
= +25NC, unless otherwise noted.) (Note 5)
Note 1: Based on junction temperature T
J
= T
C
+ (B
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Application Information section for details. The
junction temperature must not exceed +150NC.
Note 2: T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
V
CC
3.15
3.3
3.45
V
Supply Current
I
CC
9.5
14
mA
Control Voltage Range
V
CTRL
1.0
2.5
V
CTRL Input Resistance
R
CTRL
1.0
MI
Input CurrentLogic-High
I
IH
-1.0
+1.0
FA
Input Current Logic-Low
I
IL
-1.0
+1.0
FA
REF_IN Voltage
1.4
V
REF_IN Input Resistance
1.0
MI
DAC Number of Bits
Monotonic
10
bits
Input Voltage Logic-High
V
IH
2.0
V
Input Voltage Logic-Low
V
IL
0.8
V
COMP_OUT Logic-High
RDBK_EN (D9, REG3) = Logic 1,
R
LOAD
= 47k&
3.3
V
COMP_OUT Logic-Low
RDBK_EN (D9, REG3) = Logic 1,
R
LOAD
= 47k&
0
V
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